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Why Does Sulfate Copper Plating Produce Value Copper Ions
浏览: 发布日期:2019-05-13
In the process of copper electroplating, the dissolution of copper anode mainly produces divalent copper ions. The dissolution of copper in copper sulfate solution is carried out in two steps:

Cu-e——Cu    reaction 1
Cu+-e——Cu2 reaction 2

Cu ion oxidation to divalent copper ion under the action of anode is a slow reaction. The resulting copper element is deposited in the coating by electrophoresis. Copper is dissolved by the action of anodic current, normally by bivalent solution.
 
But if the anode is passivated or the current density of the anode is too low, copper may dissolve in a monovalent manner.
 
Copper ions also occur during cathodic deposition. The dissolution of burr copper anode is mainly to produce divalent copper ions. Divalent copper ions and elemental copper can also be produced by disproportionation reaction, although the content is very small, resulting in copper powder:
 
Cu2++ 2e——Cu reaction3
 
Cu2++e——Cu+  reaction 4
 
Cu++e——Cu  reaction5
 
Copper monovalent can be understood as a side reaction. The control method of electroplating is as follows:
 
1. Anode current density control, not too low;
 
2. Drum stirring to deoxidize copper monovalent;
 
3. Adding hydrogen peroxide to oxidize monovalent copper;
 
4. When the chloride ion is kept in the solution at about 80-120 ppm, the chloride ion can precipitate with the monovalent copper. At the same time, the chloride ion can promote the anodic dissolution and reduce or eliminate the monovalent copper ion.