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Maintenance of pyrophosphate copper plating
浏览: 发布日期:2019-05-13
1. Controlling the concentration of potassium pyrophosphate and copper pyrophosphate well, P is about 7-9 as compared with the general control.
 
Formulation range:
 
Potassium pyrophosphate 260-320g/l
 
Copper pyrophosphate 45-65 g/l
 
Ammonium citrate 15-25 g/l
 
Ammonia water 1~3 ml/l
 
PH 8.2-8.8
 
DK 1.0-1.5 ASD
 
Temperature 50-55 degrees Celsius
 
P is more beneficial to the complexation effect of copper ions than the recommended value of 8-9. For enterprises not suitable for light agents, the proportion can be increased and the complexation effect will be more stable.
 
2. The main salts need to be dissolved on-line, and then filtered into the aqueduct through a filter. The main salts need to be electrolytically removed at the same time. Activated carbon is used to treat the organic matter, and at the same time, the cylinder opener and other materials are added proportionally.
 
3. Because the plating solution is easy to accumulate organic matter and produce "phosphorus bacteria", it is necessary to treat the plating solution regularly with "hydrogen peroxide + activated carbon" and activated carbon. In order to avoid bacterial production, formaldehyde + activated carbon can be treated regularly.
 
4. Choose high-quality  materials.
 
5. Select high-quality "electrolytic copper plate" as the anode, and maintain the number of anodes, to avoid too few anodes and passivation or the production of copper ions, air stirring is conducive to the conversion of copper into divalent copper.
 
6. After plating, mobile washing should be used to avoid static washing. At the same time, the suspended particulate matter in the washing tank should be checked regularly and the washing water should be replaced regularly.
 
7. After the plating solution stops for a period of time, it is suggested that the treatment of "hydrogen peroxide + activated carbon" should be done immediately, and the sterilization treatment should be raised at the same time.
 
8. Strictly control PH and temperature. If some problems are found in the process of electroplating, the current density can be reduced properly.